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Applications
Chip Handling
Chip Handling Semiconductor Productivity
Our compact, modular systems incorporate advanced processing features, interfaces and motion elements engineered to handle ultra-fast chip die-cut, inspection and sorting operations. Realize substantial savings through reduced cabling, more uptime and subsystems built and tested prior to final tool assembly.


Increase Productivity
  • Modular motion control subsystems speed tool design and commissioning, delivering improved systems to market faster
  • On-line Easy-2-Combine configurator reduces complex engineering and design time
  • Highly flexible DDL bus communication modules can each control up to 14 pneumatic valve manifolds, E/P regulators, or I/O nodes
  • Linear components and subassemblies are engineered for faster assembly, speeding tool commissioning and delivery
Enhance Reliability
  • Engineered, integrated interfaces reduce cabling points of failure
  • Pneumatic DDL modules feature component level diagnostics for easy system monitoring
  • High rigidity and smooth motion of linear components help ensure accurate processing and positioning
Boost Throughput
  • Pneumatic grippers, rotary modules, mini-slides and other Easy-2-Combine components deliver repetitive precision for consistent production
  • Linear elements support repetitive high speeds, accelerations and motion for practically maintenance-free operation
  • Integrated motion control platform interfaces reduce cabling points of failure
Reduce TCO
  • Pneumatic Easy-2-Combine system features standard interfaces, eliminating design and manufacturing cost of custom adapter plates
  • Modular pneumatic and linear motion components are highly interchangeable, reducing long-term replacement costs
  • Compact, flexible motion control subsystems can be pre-tested an assembled at lower cost near the final assembly
Applications
Wafer Lift Assembly I
Wafer Lift Assembly II
Wafer Packing/Unpacking
Wet Bench Robot
CMP Brush Box
Tray Transfer
Off-Line Binner
Back-End Inspection
Metrology/Inspection
Scanning Electron Microscopy
Cleanroom Structure
Wire Bonding
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