Home Language Imprint Terms of Use www.bosch.com    
Bosch Rexroth
Semiconductor
Products and Solutions
Applications
Wafer and Substrate Handling
Chip Handling
Wire Bonding
Metrology
Photovoltaics Manufacturing
Trade Shows and Events
Service
Training
Contact
  Contact Contact   Sitemap Sitemap  
image x  
Applications
Metrology
Metrology
Experience with nanometer-scale motion control lets Bosch Rexroth provide state-of-the-art controllers and precision assemblies engineered for the accuracy and throughput requirements for reference and inline metrology applications.

Increase Productivity
Enhance Reliability
  • Engineered, integrated interfaces reduce cabling points of failure
  • High Precision BallRail guides reduce incidental movement in X, Y & Z axes by 60%, ensuring near-zero deflection during travel
  • Real-time monitoring of safety and errors reduces faults
  • Robust diagnostics help reduce downtime and Mean Time To Repair
Boost Throughput
  • Advanced motion control algorithms compensate for mechanical disruption and linearize non-linear Piezo motors.
  • Tight motion and I/O synchronization enable faster measurements coupled to motion or position
  • Linear guides offer speeds up to 5 m/s and acceleration up to 50g
Reduce TCO
  • Compact, modular systems can be assembled, pre-tested and and deliveredto the final assembly opperations as "plug and play" syetems.
  • Interchangeable rails and blocks reduce maintenance costs; designed for long-term maintenance-free operation
Applications
Wafer Lift Assembly I
Wafer Lift Assembly II
Wafer Packing/Unpacking
Wet Bench Robot
CMP Brush Box
Tray Transfer
Off-Line Binner
Back-End Inspection
Metrology/Inspection
Scanning Electron Microscopy
Cleanroom Structure
Wire Bonding
Take Action
Sales Locator
Expert Help
 
 
go to top of page | Print | Create PDF