Applications Wafer Packing/Unpacking Automated Wafer Pack and Unpack Tool Challenge The many different ways to pack/unpack silicon wafers for shipping or manufacturing present challenges to automating the process. The isolation material separating adjacent wafers may change. An OEM of wafer sorting and packing tools wanted to build a new machine that can handle “change on the fly” of the isolation materials. The challenge here was to come up with either a device or a technique that could place or remove any cleanroom surface material, even those that are porous or irregular in surface, without changing the fixture. Solution We proposed a Non-Contact Transfer (NCT), which uses the Bernoulli principal of using positive pressure to create the lifting force to pick up material. The approach is simpler and more effective than using a vacuum since it can handle the widest range of materials without concern for surface texture and the ability to form a vacuum seal. The NCT can pick up corrugated paper and porous materials. Result The NCT-based pickup mechanism gives the pack/unpack tool wide latitude in the range of materials it can handle automatically.