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Applications
Wafer and Substrate Handling
Wafer Handling Semiconductor Productivity
Bosch Rexroth’s high quality components and complete motion platforms let you focus resources on your core competencies, while we provide subsystems with extremely stable, reliable motion and control performance – for use within tools, for intertool AMHS applications, and for cleanroom manufacturing and assembly operations.

Increase Productivity
  • High performance pneumatic valves increase process efficiency and can be optimized to fit unique tool requirements
  • Modular motion control subsystems speed tool design and commissioning, delivering improved systems to market faster
  • Maintenance-free design of linear motion components helps ensure maximum uptime
  • Pneumatic non-contact transfer (NCT) devices eliminate risk of surface damage, deformation or contamination
Enhance Reliability
  • Engineered, integrated interfaces reduce cabling points of failure
  • Linear components and subsystems tested and performance certified to OEM’s requirements prior to shipping
  • Real-time monitoring of safety and errors reduces faults
  • NCTs are precision manufactured with no moving parts to fail
Boost Throughput
  • Pneumatic valves are designed to reduce cycle times through fast response times, high flow rates, integrated electronics and precise operation
  • NCTs are engineered to lift, move and place delicate, challenging materials where grippers or vacuum devices cannot be used
  • Linear guides, ball screws, and linear modules are designed to provide faster moves and higher cycle times with high precision
  • Integrated motion control platform interfaces reduce cabling points of failure
Reduce TCO
  • Linear guides feature long-term maintenance-free performance and single-point lubrication to reduce maintenance costs
  • Optimized custom pneumatic valve capabilities eliminate the cost of unnecessary features
  • Compact, flexible modular systems can be pre-tested and assembled at lower cost near the final assembly
Applications
Wafer Lift Assembly I
Wafer Lift Assembly II
Wafer Packing/Unpacking
Wet Bench Robot
CMP Brush Box
Tray Transfer
Off-Line Binner
Back-End Inspection
Metrology/Inspection
Scanning Electron Microscopy
Cleanroom Structure
Wire Bonding
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