Applications Wire Bonding Bosch Rexroth draws on its experience to build state-of-the-art control solutions and precision engineered assemblies proven to deliver micrometer-scale accurate bonding motion -- stable, repeatable and able to meet the demand for non-stop, 24/7 wire bonding throughput. Increase Productivity Custom development of specific bond-head control algorithms and support for multiple motor types, feedback devices and software interfaces High precision profiled rails provide accurate positioning and reduced X, Y and Z axis movement compared to conventional profiled rails High performance pneumatic valves increase process efficiency Enhance Reliability High Precision Ball Rail reduces incidental movement in X, Y & Z axes by 60% Integrated motion control interfaces reduce cabling points of failure Diagnostics allow quick views into motion control system elements to reduce downtime and Mean Time To Repair Boost Throughput High-performance control algorithms support ultra-fast interpolated closed-loop motion specific to bonding applications Tight motion and I/O synchronization enable faster bonding cycles Pneumatic valves are designed to reduce cycle times through fast response times, high flow rates, integrated electronics and precise operation Ball rail linear guides provide speeds up to 5 m/s and acceleration up to 50g; miniature ball rails provide speeds up to 3 m/s and acceleration up to 25g. Reduce TCO Interchangeable linear motion components make service easier and help control costs Flexible, modular motion control systems can be fully tested and assembled at lower costs near to final assembly